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Harper Corporation of America Presents at OMET Open House at Clemson

Conference title is ‘The Future of Flexo: New Year, New Technology.’

Harper Corporation of America will participate as an exhibitor and speaker at “The Future of Flexo: New Year, New Technology,” an open house presented by OMET Americas.
 
This free event will be held at Clemson University’s Sonoco Institute of Packaging Design and Graphics, which includes a Varyflex narrow web press by OMET in its Advanced Print Lab. Harper Corporation of America is a sponsor of the event.
 
In addition, Sean Teufler, technical director at Harper, will be presenting on “New Technology and Understanding Coating Applications.”
 
The event will be held Feb. 6-7, 2019 at Clemson University’s Sonoco Institute, Clemson, SC. 

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